Aluminum substrate process flow

1. Opening

Aluminum substrate production process

1. The process of cutting material - cutting

2. The purpose of opening

Cut large-sized incoming materials to the size required for production

3. Precautions for opening materials

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Drilling

1. Drilling process

Doweling - Drilling - Inspection Board

2. Purpose of drilling

Positioning and drilling of the plate to assist the subsequent production process and customer assembly

3. Precautions for drilling

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Second drill: tool hole in the unit after solder mask

3. Dry/wet film imaging

1. Dry/wet film imaging process

Grinding plate - film - exposure - development

2. Purpose of dry/wet film imaging

The parts needed to make the circuit are rendered on the sheet

3. Precautions for dry/wet film imaging

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Acid/Alkaline Etching

1. Acid/Alkaline etching process

Etching - stripping - drying - inspection board

2. Purpose of acid/alkaline etching

After imaging the dry/wet film, keep the required part of the circuit, remove the excess part outside the circuit, and pay attention to the corrosion of the aluminum substrate by the etching solution during acid etching;

3. Precautions for acid/alkaline etching

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Five, silk screen solder mask, characters

1. Silk screen solder mask, character process

Silkscreen - Pre-baking - Exposure - Development - Characters

2. The purpose of silk screen solder mask and characters

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Matters needing attention for silk screen solder mask and characters

① To check whether there is garbage or foreign matter on the board

COB aluminum substrate

COB aluminum substrate

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, gong board

1. V-CUT, gong board process

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, the purpose of the gong board

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Precautions for V-CUT and gong board

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Seven, test, OSP

1. Test, OSP process

Line Test - Withstand Voltage Test - OSP

2. Testing, the purpose of OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, testing, OSP precautions

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Eight, FQC, FQA, packaging, shipping

1. Process

FQC - FQA - Packing - Shipment

2. Purpose

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Pay attention

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3